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MCP73831/2
Miniature Single-Cell, Fully Integrated Li-Ion, Li-Polymer Charge Management Controllers
Features:
* Linear Charge Management Controller: - Integrated Pass Transistor - Integrated Current Sense - Reverse Discharge Protection * High Accuracy Preset Voltage Regulation: + 0.75% * Four Voltage Regulation Options: - 4.20V, 4.35V, 4.40V, 4.50V * Programmable Charge Current * Selectable Preconditioning * Selectable End-of-Charge Control * Charge Status Output - Tri-State Output - MCP73831 - Open-Drain Output - MCP73832 * Automatic Power-Down * Thermal Regulation * Temperature Range: -40C to +85C * Packaging: - 8-Lead, 2 mm x 3 mm DFN - 5-Lead, SOT23
Description:
The MCP73831/2 devices are highly advanced linear charge management controllers for use in space-limited, cost-sensitive applications. The MCP73831/2 are available in an 8-Lead, 2 mm x 3 mm DFN package or a 5-Lead, SOT23 package. Along with their small physical size, the low number of external components required make the MCP73831/2 ideally suited for portable applications. For applications charging from a USB port, the MCP73831/2 adhere to all the specifications governing the USB power bus. The MCP73831/2 employ a constant-current/constantvoltage charge algorithm with selectable preconditioning and charge termination. The constant voltage regulation is fixed with four available options: 4.20V, 4.35V, 4.40V or 4.50V, to accommodate new, emerging battery charging requirements. The constant current value is set with one external resistor. The MCP73831/2 devices limit the charge current based on die temperature during high power or high ambient conditions. This thermal regulation optimizes the charge cycle time while maintaining device reliability. Several options are available for the preconditioning threshold, preconditioning current value, charge termination value and automatic recharge threshold. The preconditioning value and charge termination value are set as a ratio, or percentage, of the programmed constant current value. Preconditioning can be disabled. Refer to Section 1.0 "Electrical Characteristics" for available options and the "Product Identification System" for standard options. The MCP73831/2 devices are fully specified over the ambient temperature range of -40C to +85C.
Applications:
* * * * * * * Lithium-Ion/Lithium-Polymer Battery Chargers Personal Data Assistants Cellular Telephones Digital Cameras MP3 Players Bluetooth Headsets USB Chargers
Typical Application
500 mA Li-Ion Battery Charger
VIN 4.7 F 4V DD VBAT 3 4.7 F 5 2 k
Package Types
8-Lead DFN (2 mm x 3 mm)
VDD 1 VDD 2 4 VDD VBAT 3 VBAT 4 8 PROG 7 NC 6 VSS 5 STAT
SOT23-5
+ Single Li-Ion - Cell STAT 1 VSS 2 VBAT 3 5 PROG
PROG 470 1 STAT
VSS 2
MCP73831
(c) 2006 Microchip Technology Inc.
DS21984B-page 1
MCP73831/2
Functional Block Diagram
VDD 6 mA DIRECTION CONTROL VBAT
6 mA
G=0.001
PROG
0.5 mA + 43.6 k 361 k 89 k 111 k + TERMINATION + CHARGE 15 k STAT + 3.9 k VDD CA MCP73831 ONLY
REFERENCE GENERATOR VREF(1.22V)
PRECONDITION
182.3 k
7 k
+ 190 k
VA
111 k + + + SHDN DIRECTION CONTROL UVLO
0.5 mA VBAT
477 k 255 k 100 k
VSS
DS21984B-page 2
(c) 2006 Microchip Technology Inc.
MCP73831/2
1.0 ELECTRICAL CHARACTERISTICS
Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
Absolute Maximum Ratings
VDD...................................................................................7.0V All Inputs and Outputs w.r.t. VSS ............... -0.3 to (VDD+0.3)V Maximum Junction Temperature, TJ ............ Internally Limited Storage temperature .....................................-65C to +150C ESD protection on all pins: Human Body Model (1.5 k in Series with 100 pF)....... 4 kV Machine Model (200 pF, No Series Resistance) .............400V
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD= [VREG(typ.) + 0.3V] to 6V, TA = -40C to +85C. Typical values are at +25C, VDD = [VREG (typ.) + 1.0V] Parameters Supply Input Supply Voltage Supply Current VDD ISS 3.75 -- -- -- -- -- UVLO Start Threshold UVLO Stop Threshold UVLO Hysteresis Regulated Output Voltage VSTART VSTOP VHYS VREG 3.3 3.2 -- 4.168 4.317 4.367 4.466 -- 510 53 25 1 0.1 3.45 3.38 70 4.20 4.35 4.40 4.50 6 1500 200 50 5 2 3.6 3.5 -- 4.232 4.383 4.433 4.534 V A A A A A V V mV V V V V MCP7383X-2 MCP7383X-3 MCP7383X-4 MCP7383X-5 VDD = [VREG(Typ)+1V] IOUT = 10 mA TA = -5C to +55C Line Regulation Load Regulation Supply Ripple Attenuation |(VBAT/VBAT )/VDD| |VBAT/VBAT| PSRR -- -- -- -- -- Current Regulation (Fast Charge Constant-Current Mode) Fast Charge Current Regulation IREG 90 450 100 505 110 550 mA mA PROG = 10 k PROG = 2.0 k, Note 1 TA = -5C to +55C Note 1: Not production tested. Ensured by design. 0.09 0.05 52 47 22 0.30 0.30 ---- -- %/V % dB dB dB VDD = [VREG(Typ)+1V] to 6V IOUT = 10 mA IOUT = 10 mA to 50 mA VDD = [VREG(Typ)+1V] IOUT=10 mA, 10Hz to 1 kHz IOUT=10 mA, 10Hz to 10 kHz IOUT=10 mA, 10Hz to 1 MHz Charging Charge Complete, No Battery PROG Floating VDD < (VBAT - 50 mV) VDD < VSTOP VDD Low-to-High VDD High-to-Low Sym. Min. Typ. Max. Units Conditions
Voltage Regulation (Constant-Voltage Mode)
(c) 2006 Microchip Technology Inc.
DS21984B-page 3
MCP73831/2
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD= [VREG(typ.) + 0.3V] to 6V, TA = -40C to +85C. Typical values are at +25C, VDD = [VREG (typ.) + 1.0V] Parameters Sym. Min. Typ. Max. Units Conditions
Preconditioning Current Regulation (Trickle Charge Constant-Current Mode) Precondition Current Ratio IPREG / IREG 7.5 15 30 -- Precondition Voltage Threshold Ratio Precondition Hysteresis Charge Termination Charge Termination Current Ratio ITERM / IREG 3.75 5.6 7.5 15 Automatic Recharge Recharge Voltage Threshold Ratio VRTH / VREG 91.5 94 RDSON IDISCHARGE -- -- -- -- -- Status Indicator - STAT Sink Current Low Output Voltage Source Current High Output Voltage Input Leakage Current PROG Input Charge Impedance Range Minimum Shutdown Impedance Automatic Power Down Automatic Power Down Entry Threshold Automatic Power Down Exit Threshold Thermal Shutdown Die Temperature Die Temperature Hysteresis Note 1: TSD TSDHYS -- -- 150 10 -- -- C C VPDENTER VPDEXIT VDD<(VBAT +20mV) -- VDD<(VBAT +50mV) VDD<(VBAT +150mV) -- VDD<(VBAT +200mV) 3.5V VBAT VREG VDD Falling 3.5V VBAT VREG VDD Rising RPROG RPROG 2 70 -- -- 20 200 k k ISINK VOL ISOURCE VOH ILK -- -- -- -- -- -- 0.4 -- VDD-0.4 0.03 25 1 35 VDD - 1 1 mA V mA V A ISOURCE = 4 mA (MCP73831) High-Impedance ISINK = 4 mA 94.0 96.5 350 0.15 0.25 0.15 -5.5 96.5 99 -- 2 2 2 -15 % % m A A A A VBAT High-to-Low VBAT High-to-Low VDD = 3.75V, TJ = 105C PROG Floating VDD Floating VDD < VSTOP Charge Complete 5 7.5 10 20 6.25 9.4 12.5 25 % % % % PROG = 2.0 k to 10 k PROG = 2.0 k to 10 k PROG = 2.0 k to 10 k PROG = 2.0 k to 10 k TA = -5C to +55C VPTH / VREG VPHYS 64 69 -- 10 20 40 100 66.5 71.5 110 12.5 25 50 -- 69 74 -- % % % % % % mV PROG = 2.0 k to 10 k PROG = 2.0 k to 10 k PROG = 2.0 k to 10 k No Preconditioning TA = -5C to +55C VBAT Low-to-High VBAT Low-to-High VBAT High-to-Low
Pass Transistor ON-Resistance ON-Resistance Battery Discharge Current Output Reverse Leakage Current
Not production tested. Ensured by design.
DS21984B-page 4
(c) 2006 Microchip Technology Inc.
MCP73831/2
AC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD = [VREG (typ.) + 0.3V] to 12V, TA = -40C to +85C. Typical values are at +25C, VDD = [VREG (typ.) + 1.0V] Parameters UVLO Start Delay Constant-Current Regulation Transition Time Out of Preconditioning Current Rise Time Out of Preconditioning Termination Comparator Filter Charge Comparator Filter Status Indicator Status Output turn-off Status Output turn-on tOFF tON -- -- -- -- 200 200
s s
Sym. tSTART tDELAY tRISE tTERM tCHARGE
Min. -- -- -- 0.4 0.4
Typ. -- -- -- 1.3 1.3
Max. 5 1 1 3.2 3.2
Units ms ms ms ms ms
Conditions VDD Low-to-High VBAT < VPTH to VBAT > VPTH IOUT Rising to 90% of IREG Average IOUT Falling Average VBAT ISINK = 1 mA to 0 mA ISINK = 0 mA to 1 mA
TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD = [VREG (typ.) + 0.3V] to 12V. Typical values are at +25C, VDD = [VREG (typ.) + 1.0V] Parameters Temperature Ranges Specified Temperature Range Operating Temperature Range Storage Temperature Range Thermal Package Resistances 5-Lead, SOT23 8-Lead, 2 mm x 3 mm, DFN JA JA -- -- 230 76 -- -- C/W C/W 4-Layer JC51-7 Standard Board, Natural Convection 4-Layer JC51-7 Standard Board, Natural Convection TA TJ TA -40 -40 -65 -- -- -- +85 +125 +150 C C C Sym. Min. Typ. Max. Units Conditions
(c) 2006 Microchip Technology Inc.
DS21984B-page 5
MCP73831/2
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
NOTE: Unless otherwise indicated, VDD = [VREG(typ.) + 1V], IOUT = 10 mA and TA= +25C, Constant-Voltage mode.
4.210 4.205 4.200 4.195 4.190 4.185 4.180 4.175 4.170 4.50 4.75 5.00 5.25 5.50 5.75 6.00
IOUT = 450 mA IOUT = 100 mA IOUT = 10 mA
Battery Regulation Voltage (V)
MCP73831-2
550 500 450 400 350 300 250 200 150 100 50 0 2 4 6 8 10 12 14 16 18 20 Programming Resistor (k)
Supply Voltage (V)
FIGURE 2-1: Battery Regulation Voltage (VBAT) vs. Supply Voltage (VDD).
Battery Regulation Voltage (V)
FIGURE 2-4: Charge Current (IOUT) vs. Programming Resistor (RPROG).
104
Charge Current (mA)
4.210 4.205 4.200 4.195 4.190 4.185 4.180 4.175 4.170
Charge Current (mA)
MCP73831-2 IOUT = 10 mA
RPROG = 10 k
103 102 101 100 99 98 97 96 4.50 4.75 5.00 5.25 5.50 5.75 6.00
IOUT = 100 mA
IOUT = 450 mA
10
20
30
40
50
60
70
-40
-30
-20
-10
80
0
Ambient Temperature (C)
Supply Voltage (V)
FIGURE 2-2: Battery Regulation Voltage (VBAT) vs. Ambient Temperature (TA).
0.40
+85C -40C
FIGURE 2-5: Charge Current (IOUT) vs. Supply Voltage (VDD).
516 Charge Current (mA) 514 512 510 508 506 504 502 500 4.50 4.75 5.00 5.25 5.50 5.75 6.00
RPROG = 2 k
Output Leakage Current (A)
0.35 0.30 0.25 0.20 0.15 0.10 0.05
+25C
0.00 3.00
3.20
3.40
3.60
3.80
4.00
4.20
Battery Regulation Voltage (V)
Supply Voltage (V)
FIGURE 2-3: Output Leakage Current (IDISCHARGE) vs. Battery Regulation Voltage (VBAT).
FIGURE 2-6: Charge Current (IOUT) vs. Supply Voltage (VDD).
DS21984B-page 6
(c) 2006 Microchip Technology Inc.
MCP73831/2
TYPICAL PERFORMANCE CURVES (CONTINUED)
NOTE: Unless otherwise indicated, VDD = [VREG(typ.) + 1V], IOUT = 10 mA and TA= +25C, Constant-Voltage mode.
104
Charge Current (mA)
102 101 100 99 98 97 96
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80
Charge Current (mA)
103
RPROG = 10 k
525 450 375 300 225 150 75 0
25 35 45 55 65 75 85 95 105 115
RPROG = 2 k
125
135
145
Ambient Temperature (C)
Junction Temperature (C)
FIGURE 2-7: Charge Current (IOUT) vs. Ambient Temperature (TA).
516
Charge Current (mA)
FIGURE 2-10: Charge Current (IOUT) vs. Junction Temperature (TJ).
0 -10
Attenuation (dB)
514 512 510 508 506 504 502 500
0 10 20 30 40 50
RPROG = 2 k
VAC = 100 mVp-p IOUT = 10 mA COUT = 4.7 F, X7R Ceramic
-20 -30 -40 -50
-40
-30
-20
-10
-60 0.01
60
70
80
0.1
1
10
100
1000
Ambient Temperature (C)
Frequency (kHz)
FIGURE 2-8: Charge Current (IOUT) vs. Ambient Temperature (TA).
120
Charge Current (mA)
FIGURE 2-11: Power Supply Ripple Rejection (PSRR).
0 -10
Attenuation (dB)
105 90 75 60 45 30 15 0
25 35 45 55 65 75 85 95 105 115
RPROG = 10 k
VAC = 100 mVp-p IOUT = 100 mA COUT = 4.7 F, X7R Ceramic
-20 -30 -40 -50 -60 0.01
125
135
145
155
0.1
1
10
100
1000
Junction Temperature (C)
Frequency (kHz)
FIGURE 2-9: Charge Current (IOUT) vs. Junction Temperature (TJ).
FIGURE 2-12: Power Supply Ripple Rejection (PSRR).
(c) 2006 Microchip Technology Inc.
DS21984B-page 7
155
MCP73831/2
TYPICAL PERFORMANCE CURVES (CONTINUED)
NOTE: Unless otherwise indicated, VDD = [VREG(typ.) + 1V], IOUT = 10 mA and TA= +25C, Constant-Voltage mode.
14
Source Voltage (V)
0.10 0.05
Output Current (A) Output Ripple (V)
1.40 1.20 1.00 0.80 0.60 0.40 0.20 0.00 -0.20
0 20
COUT = 4.7 F, X7R Ceramic
0.10 0.05 0.00 -0.05 -0.10 -0.15 -0.20 -0.25 -0.30
180 200 Output Ripple (V) Charge Current (mA) Charge Current (mA)
12 10 8 6 4 2 0 -2
0 20 40 60 80 100 120 140 160 180 200
IOUT = 10 mA COUT = 4.7 F, X7R Ceramic
0.00 -0.05 -0.10 -0.15 -0.20 -0.25 -0.30
40
60
80
100
120
140
Time (s)
Time (s)
FIGURE 2-13:
14
Source Voltage (V)
Line Transient Response.
0.10 0.00 -0.05 -0.10 -0.15 -0.20 -0.25 -0.30
160 180 200
FIGURE 2-16:
6.0
Battery Voltage (V)
Load Transient Response.
120 100 80 60 40
12 10 8 6 4 2 0 -2
0 20 40 60 80 100 120 140
IOUT = 100 mA COUT = 4.7 F, X7R Ceramic
0.05
Output Ripple (V)
5.0 4.0 3.0 2.0 1.0 0.0
0 20 40 60 80 100 120 140 160 180
MCP73831-2AC/IOT VDD = 5.2V RPROG = 10 k
160
20 0
Time (s)
Time (minutes)
FIGURE 2-14:
Line Transient Response.
FIGURE 2-17: Complete Charge Cycle (180 mAh Li-Ion Battery).
6.0
Battery Voltage (V)
0.35
Output Current (A)
0.04 0.02 0.00 -0.02 -0.04 -0.06 -0.08
COUT = 4.7 F, X7R Ceramic
600 500 400 300 200
MCP73831-2AC/IOT VDD = 5.2V RPROG = 2 k
0.30 0.25 0.20 0.15 0.10 0.05 0.00 -0.05
0 20 40 60 80 100 120 140 160 180 200
Output Ripple (V)
5.0 4.0 3.0 2.0 1.0 0.0
0 30 60 90 120 150 180 210 240
-0.10 -0.12
100 0
Time (s)
Time (minutes)
FIGURE 2-15:
Load Transient Response.
FIGURE 2-18: Complete Charge Cycle (1000 mAh Li-Ion Battery).
DS21984B-page 8
(c) 2006 Microchip Technology Inc.
MCP73831/2
3.0 PIN DESCRIPTION
PIN FUNCTION TABLES
Symbol DFN 1 2 3 4 5 6 7 8 SOT23-5 4 -- 3 -- 1 2 -- 5 VDD VDD VBAT VBAT STAT VSS NC PROG Battery Management Input Supply Battery Management Input Supply Battery Charge Control Output Battery Charge Control Output Charge Status Output Battery Management 0V Reference No Connection Current Regulation Set and Charge Control Enable Function
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
Pin No.
3.1
Battery Management Input Supply (VDD)
3.4
Battery Management 0V Reference (VSS)
A supply voltage of [VREG (typ.) + 0.3V] to 6V is recommended. Bypass to VSS with a minimum of 4.7 F.
Connect to negative terminal of battery and input supply.
3.5 3.2 Battery Charge Control Output (VBAT)
Current Regulation Set (PROG)
Preconditioning, fast charge and termination currents are scaled by placing a resistor from PROG to VSS. The charge management controller can be disabled by allowing the PROG input to float.
Connect to positive terminal of battery. Drain terminal of internal P-channel MOSFET pass transistor. Bypass to VSS with a minimum of 4.7 F to ensure loop stability when the battery is disconnected.
3.3
Charge Status Output (STAT)
STAT is an output for connection to an LED for charge status indication. Alternatively, a pull-up resistor can be applied for interfacing to a host microcontroller. STAT is a tri-state logic output on the MCP73831 and an open-drain output on the MCP73832.
(c) 2006 Microchip Technology Inc.
DS21984B-page 9
MCP73831/2
4.0 DEVICE OVERVIEW
The UVLO circuit places the device in Shutdown mode if the input supply falls to within +50 mV of the battery voltage. Again, the input supply must rise to a level 150 mV above the battery voltage before the MCP73831/2 become operational. The UVLO circuit is always active. At any time the input supply is below the UVLO threshold or within +50 mV of the voltage at the VBAT pin, the MCP73831/2 are placed in a Shutdown mode. During any UVLO condition, the battery reverse discharge current shall be less than 2 A. The MCP73831/2 are highly advanced linear charge management controllers. Figure 4-1 depicts the operational flow algorithm from charge initiation to completion and automatic recharge.
SHUTDOWN MODE VDD < VUVLO VDD < VBAT or PROG > 200 k STAT = Hi-Z VBAT < VPTH PRECONDITIONING MODE Charge Current = IPREG STAT = LOW VBAT > VPTH FAST CHARGE MODE Charge Current = IREG STAT = LOW VBAT > VPTH VBAT < VRTH
4.2
Charge Qualification
For a charge cycle to begin, all UVLO conditions must be met and a battery or output load must be present. A charge current programming resistor must be connected from PROG to VSS. If the PROG pin is open or floating, the MCP73831/2 are disabled and the battery reverse discharge current is less than 2 A. In this manner, the PROG pin acts as a charge enable and can be used as a manual shutdown.
4.3
Preconditioning
VBAT = VREG CONSTANT VOLTAGE MODE Charge Voltage = VREG STAT = LOW IBAT < ITERM CHARGE COMPLETE MODE No Charge Current STAT = HIGH (MCP73831) STAT = Hi-Z (MCP73832)
If the voltage at the VBAT pin is less than the preconditioning threshold, the MCP73831/2 enter a preconditioning or Trickle Charge mode. The preconditioning threshold is factory set. Refer to Section 1.0 "Electrical Characteristics" for preconditioning threshold options and the Product Identification System for standard options. In this mode, the MCP73831/2 supply a percentage of the charge current (established with the value of the resistor connected to the PROG pin) to the battery. The percentage or ratio of the current is factory set. Refer to Section 1.0 "Electrical Characteristics" for preconditioning current options and the Product Identification System for standard options. When the voltage at the VBAT pin rises above the preconditioning threshold, the MCP73831/2 enter the Constant-Current or Fast Charge mode.
FIGURE 4-1:
Flowchart.
4.1
Under Voltage Lockout (UVLO) 4.4 Fast Charge Constant-Current Mode
An internal UVLO circuit monitors the input voltage and keeps the charger in Shutdown mode until the input supply rises above the UVLO threshold. The UVLO circuitry has a built in hysteresis of 100 mV. In the event a battery is present when the input power is applied, the input supply must rise 150 mV above the battery voltage before the MCP73831/2 becomes operational.
During the Constant-Current mode, the programmed charge current is supplied to the battery or load. The charge current is established using a single resistor from PROG to VSS. Constant-Current mode is maintained until the voltage at the VBAT pin reaches the regulation voltage, VREG.
DS21984B-page 10
(c) 2006 Microchip Technology Inc.
MCP73831/2
4.5 Constant-Voltage Mode 4.8 Thermal Regulation
When the voltage at the VBAT pin reaches the regulation voltage, VREG, constant voltage regulation begins. The regulation voltage is factory set to 4.2V, 4.35V, 4.40V, or 4.50V with a tolerance of 0.75%. The MCP73831/2 limit the charge current based on the die temperature. The thermal regulation optimizes the charge cycle time while maintaining device reliability. Figure 4-2 depicts the thermal regulation for the MCP73831/2.
525
RPROG = 2 k
4.6
Charge Termination
Charge Current (mA)
The charge cycle is terminated when, during ConstantVoltage mode, the average charge current diminishes below a percentage of the programmed charge current (established with the value of the resistor connected to the PROG pin). A 1 ms filter time on the termination comparator ensures that transient load conditions do not result in premature charge cycle termination. The percentage or ratio of the current is factory set. Refer to Section 1.0 "Electrical Characteristics" for charge termination current options and the "Product Identification System" for standard options. The charge current is latched off and the MCP73831/2 enter a Charge Complete mode.
450 375 300 225 150 75 0 25 35 45 55 65 75 85 95 105 115 125 135 145 155
Junction Temperature (C)
FIGURE 4-2:
Thermal Regulation.
4.7
Automatic Recharge
4.9
Thermal Shutdown
The MCP73831/2 continuously monitor the voltage at the VBAT pin in the Charge Complete mode. If the voltage drops below the recharge threshold, another charge cycle begins and current is once again supplied to the battery or load. The recharge threshold is factory set. Refer to Section 1.0 "Electrical Characteristics" for recharge threshold options and the Product Identification System for standard options.
The MCP73831/2 suspend charge if the die temperature exceeds 150C. Charging will resume when the die temperature has cooled by approximately 10C.
(c) 2006 Microchip Technology Inc.
DS21984B-page 11
MCP73831/2
5.0
5.1
5.1.1
DETAILED DESCRIPTION
Analog Circuitry
BATTERY MANAGEMENT INPUT SUPPLY (VDD)
5.2
5.2.1
Digital Circuitry
STATUS INDICATOR (STAT)
The VDD input is the input supply to the MCP73831/2. The MCP73831/2 automatically enter a Power-Down mode if the voltage on the VDD input falls below the UVLO voltage (VSTOP). This feature prevents draining the battery pack when the VDD supply is not present.
The charge status output of the MCP73831 has three different states: High (H), Low (L), and High-Impedance (Hi-Z). The charge status output of the MCP73832 is open-drain, and, as such, has two different states: Low (L), and High-Impedance (Hi-Z). The charge charge status output can be used to illuminate 1, 2, or tri-color LEDs. Optionally, the charge status output can be used as an interface to a host microcontroller. Table 5-1 summarize the state of the status output during a charge cycle..
5.1.2
CURRENT REGULATION SET (PROG)
Fast charge current regulation can be scaled by placing a programming resistor (RPROG) from the PROG input to VSS. The program resistor and the charge current are calculated using the following equation: 1000V I REG = ---------------RPROG Where: RPROG IREG = = kOhms milliampere
TABLE 5-1:
STATUS OUTPUT
STAT1
Charge Cycle State MCP73831 MCP73832 Shutdown No Battery Present Preconditioning Constant-Current Fast Charge Constant Voltage Charge Complete - Standby Hi-Z Hi-Z L L L H Hi-Z Hi-Z L L L Hi-Z
The preconditioning trickle charge current and the charge termination current are ratiometric to the fast charge current based on the selected device options.
5.2.2
DEVICE DISABLE (PROG)
5.1.3
BATTERY CHARGE CONTROL OUTPUT (VBAT)
The battery charge control output is the drain terminal of an internal P-channel MOSFET. The MCP73831/2 provide constant current and voltage regulation to the battery pack by controlling this MOSFET in the linear region. The battery charge control output should be connected to the positive terminal of the battery pack.
The current regulation set input pin (PROG) can be used to terminate a charge at any time during the charge cycle, as well as to initiate a charge cycle or initiate a recharge cycle. Placing a programming resistor from the PROG input to VSS enables the device. Allowing the PROG input to float or by applying a logic-high input signal, disables the device and terminates a charge cycle. When disabled, the device's supply current is reduced to 25 A, typically.
DS21984B-page 12
(c) 2006 Microchip Technology Inc.
MCP73831/2
6.0 APPLICATIONS
The MCP73831/2 are designed to operate in conjunction with a host microcontroller or in a stand-alone application. The MCP73831/2 provide the preferred charge algorithm for Lithium-Ion and Lithium-Polymer cells constant current followed by constant voltage. Figure 6-1 depicts a typical stand-alone application circuit, while Figures 6-2 and 6-3 depict the accompanying charge profile.
Li-Ion Battery Charger 4V DD CIN RLED STAT REGULATED WALL CUBE LED 1 VSS 2 MCP73831 PROG 5 RPROG VBAT 3 COUT + Single Li-Ion - Cell
FIGURE 6-1:
6.0
Battery Voltage (V)
Typical Application Circuit.
120
Charge Current (mA) Battery Voltage (V)
6.0 5.0 4.0 3.0 2.0 1.0 0.0
0 30 60 90 120 150 180 210 240
MCP73831-2AC/IOT VDD = 5.2V RPROG = 2 k
600 500 400 300 200 100 0
Charge Current (mA)
5.0 4.0 3.0 2.0 1.0 0.0
0 20 40 60 80 100 120 140 160 180
MCP73831-2AC/IOT VDD = 5.2V RPROG = 10 k
100 80 60 40 20 0
Time (minutes)
Time (minutes)
FIGURE 6-2: Typical Charge Profile (180 mAh Battery).
FIGURE 6-3: Typical Charge Profile in Thermal Regulation (1000 mAh Battery).
6.1
Application Circuit Design
6.1.1.1 Current Programming Resistor (RPROG)
Due to the low efficiency of linear charging, the most important factors are thermal design and cost, which are a direct function of the input voltage, output current and thermal impedance between the battery charger and the ambient cooling air. The worst-case situation is when the device has transitioned from the Preconditioning mode to the Constant-Current mode. In this situation, the battery charger has to dissipate the maximum power. A trade-off must be made between the charge current, cost and thermal requirements of the charger.
The preferred fast charge current for Lithium-Ion cells is at the 1C rate, with an absolute maximum current at the 2C rate. For example, a 500 mAh battery pack has a preferred fast charge current of 500 mA. Charging at this rate provides the shortest charge cycle times without degradation to the battery pack performance or life.
6.1.1
COMPONENT SELECTION
Selection of the external components in Figure 6-1 is crucial to the integrity and reliability of the charging system. The following discussion is intended as a guide for the component selection process.
(c) 2006 Microchip Technology Inc.
DS21984B-page 13
MCP73831/2
6.1.1.2 Thermal Considerations 6.1.1.5 Charge Inhibit
The worst-case power dissipation in the battery charger occurs when the input voltage is at the maximum and the device has transitioned from the Preconditioning mode to the Constant-Current mode. In this case, the power dissipation is:
PowerDissipation = ( V DDMAX -V PTHMIN )xI REGMAX
The current regulation set input pin (PROG) can be used to terminate a charge at any time during the charge cycle, as well as to initiate a charge cycle or initiate a recharge cycle. Placing a programming resistor from the PROG input to VSS enables the device. Allowing the PROG input to float or by applying a logic-high input signal, disables the device and terminates a charge cycle. When disabled, the device's supply current is reduced to 25 A, typically.
Where: VDDMAX IREGMAX VPTHMIN = = = the maximum input voltage the maximum fast charge current the minimum transition threshold voltage
6.1.1.6
Charge Status Interface
Power dissipation with a 5V, 10% input voltage source is:
PowerDissipation = ( 5.5V - 2.7V ) x 550mA = 1.54W
A status output provides information on the state of charge. The output can be used to illuminate external LEDs or interface to a host microcontroller. Refer to Table 5-1 for a summary of the state of the status output during a charge cycle.
6.2
This power dissipation with the battery charger in the SOT23-5 package will cause thermal regulation to be entered as depicted in Figure 6-3. Alternatively, the 2mm x 3mm DFN package could be utilized to reduce charge cycle times.
PCB Layout Issues
For optimum voltage regulation, place the battery pack as close as possible to the device's VBAT and VSS pins. This is recommended to minimize voltage drops along the high current-carrying PCB traces. If the PCB layout is used as a heatsink, adding many vias in the heatsink pad can help conduct more heat to the backplane of the PCB, thus reducing the maximum junction temperature. Figures 6-4 and 6-5 depict a typical layout with PCB heatsinking.
RLED LED VSS RPROG
6.1.1.3
External Capacitors
The MCP73831/2 are stable with or without a battery load. In order to maintain good AC stability in the Constant-Voltage mode, a minimum capacitance of 4.7 F is recommended to bypass the VBAT pin to VSS. This capacitance provides compensation when there is no battery load. In addition, the battery and interconnections appear inductive at high frequencies. These elements are in the control feedback loop during Constant-Voltage mode. Therefore, the bypass capacitance may be necessary to compensate for the inductive nature of the battery pack. Virtually any good quality output filter capacitor can be used, independent of the capacitor's minimum Effective Series Resistance (ESR) value. The actual value of the capacitor (and its associated ESR) depends on the output load current. A 4.7 F ceramic, tantalum or aluminum electrolytic capacitor at the output is usually sufficient to ensure stability for output currents up to a 500 mA.
VBAT
COUT MCP73831 C IN
VDD
FIGURE 6-4:
Typical Layout (Top).
VSS
6.1.1.4
Reverse-Blocking Protection
VBAT
VDD
The MCP73831/2 provide protection from a faulted or shorted input. Without the protection, a faulted or shorted input would discharge the battery pack through the body diode of the internal pass transistor.
FIGURE 6-5:
Typical Layout (Bottom).
DS21984B-page 14
(c) 2006 Microchip Technology Inc.
MCP73831/2
7.0
7.1
PACKAGING INFORMATION
Package Marking Information
8-Lead DFN (2 mm x 3 mm)
Device MCP73831T-2ACI/MC MCP73831T-2ATI/MC MCP73831T-2DCI/MC MCP73831T-3ACI/MC MCP73831T-4ADI/MC MCP73831T-5ACI/MC MCP73832T-2ACI/MC MCP73832T-2ATI/MC MCP73832T-2DCI/MC MCP73832T-3ACI/MC MCP73832T-4ADI/MC MCP73832T-5ACI/MC Code AAE AAF AAG AAH AAJ AAK AAL AAM AAP AAQ AAR AAS
Example:
XXX YWW NN
AAE 610 25
Note: Applies to 8-Lead DFN
5-Lead SOT-23
Example:
Device
Code KDNN KENN KFNN KGNN KHNN KJNN KKNN KLNN KMNN KPNN KQNN KRNN
XXNN
MCP73831T-2ACI/OT MCP73831T-2ATI/OT MCP73831T-2DCI/OT MCP73831T-3ACI/OT MCP73831T-4ADI/OT MCP73831T-5ACI/OT MCP73832T-2ACI/OT MCP73832T-2ATI/OT MCP73832T-2DCI/OT MCP73832T-3ACI/OT MCP73832T-4ADI/OT MCP73832T-5ACI/OT
KD25
Note: Applies to 5-Lead SOT-23
Legend: XX...X Y YY WW NNN
e3
*
Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package.
Note:
In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.
(c) 2006 Microchip Technology Inc.
DS21984B-page 15
MCP73831/2
8-Lead Plastic Dual-Flat, No-Lead Package (MC) 2x3x0.9 mm Body (DFN) - Saw Singulated
D
b
p n L
K
E
E2
EXPOSED METAL PAD (NOTE 2) PIN 1 ID INDEX AREA (NOTE 1)
DETAIL TOP VIEW
ALTERNATE CONTACT CONFIGURATION
2 D2
1
BOTTOM VIEW
A1 A3
A
EXPOSED TIE BAR (NOTE 3)
Units Dimension Limits Number of Pins Pitch Overall Height Standoff Contact Thickness Overall Length Overall Width Exposed Pad Length Exposed Pad Width Contact Length Contact-to-Exposed Pad Contact Width n e A A1 A3 D E D2 E2 L K b .051 .059 .012 .008 .008 .031 .000 MIN
INCHES NOM 8 .020 BSC .035 .001 .008 REF. .079 BSC .118 BSC - - .016 - .010 .069 .075 .020 - .012 1.30** 1.50** 0.30 0.20 0.20 .039 .002 0.80 0.00 MAX MIN
MILLIMETERS* NOM 8 0.50 BSC 0.90 0.02 0.20 REF. 2.00 BSC 3.00 BSC - - 0.40 - 0.25 1.75 1.90 0.50 - 0.30 1.00 0.05 MAX
* Controlling Parameter ** Not within JEDEC parameters Significant Characteristic Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Exposed pad may vary according to die attach paddle size. 3. Package may have one or more exposed tie bars at ends. BSC: Basic Dimension. Theoretically exact value shown without tolerances. See ASME Y14.5M REF: Reference Dimension, usually without tolerance, for information purposes only. See ASME Y14.5M JEDEC Equivalent MO-229 VCED-2 DWG No. C04-123
Revised 09-12-05
DS21984B-page 16
(c) 2006 Microchip Technology Inc.
MCP73831/2
5-Lead Plastic Small Outline Transistor (OT) (SOT-23)
E E1
p B p1 D
n
1
c A A2
Units Dimension Limits Number of Pins Pitch Outside lead pitch (basic) Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom n p p1 A A2 A1 E E1 D L f c B a b
L
A1
INCHES* MIN NOM 5 .038 .075 .035 .035 .000 .102 .059 .110 .014 0 .004 .014 0 0 .046 .043 .003 .110 .064 .116 .018 5 .006 .017 5 5 .057 .051 .006 .118 .069 .122 .022 10 .008 .020 10 10 0.35 0.90 0.90 0.00 2.60 1.50 2.80 0.35 MAX MIN
MILLIMETERS NOM 5 0.95 1.90 1.18 1.10 0.08 2.80 1.63 2.95 0.45 0 0.09 0 0 0.15 0.43 5 5 5 1.45 1.30 0.15 3.00 1.75 3.10 0.55 10 0.20 0.50 10 10 MAX
* Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. EIAJ Equivalent: SC-74A Revised 09-12-05 Drawing No. C04-091
(c) 2006 Microchip Technology Inc.
DS21984B-page 17
MCP73831/2
NOTES:
DS21984B-page 18
(c) 2006 Microchip Technology Inc.
MCP73831/2
APPENDIX A: REVISION HISTORY
Revision B (March 2006)
* Added MCP73832 through document.
Revision A (November 2005)
* Original Release of this Document.
(c) 2006 Microchip Technology Inc.
DS21984B-page 19
MCP73831/2
NOTES:
DS21984B-page 20
(c) 2006 Microchip Technology Inc.
MCP73831/2
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. Device
-X VREG
XX
X
/XX
Examples: *
a) MCP73831-2ACI/OT: 4.20V VREG, Options AC, 5LD SOT23 Pkg MCP73831T-2ACI/OT: Tape and Reel, 4.20V VREG, Options AC, 5LD SOT23 Pkg MCP73832-2ACI/MC: 4.20V VREG, Options AC, 8LD DFN Package MCP73832T-2ACI/MC: Tape and Reel, 4.20V VREG, Options AC, 8LD DFN Package MCP73831-2ATI/OT: 4.20V VREG, Options AT, 5LD SOT23 Pkg MCP73831T-2ATI/OT: Tape and Reel, 4.20V VREG, Options AT, 5LD SOT23 Pkg MCP73832-2ATI/MC: 4.20V VREG, Options AT, 8LD DFN Package MCP73832T-2ATI/MC: Tape and Reel, 4.20V VREG, Options AT, 8LD DFN Package MCP73831-2DCI/OT: 4.20V VREG, Options DC, 5LD SOT23 Pkg MCP73831T-2DCI/OT: Tape and Reel, 4.20V VREG, Options DC, 5LD SOT23 Pkg MCP73832-2DCI/MC: 4.20V VREG, Options DC, 8LD DFN Package MCP73832T-2DCI/MC: Tape and Reel, 4.20V VREG, Options DC, 8LD DFN Package MCP73831-3ACI/OT: 4.35V VREG, Options AC, 5LD SOT23 Pkg MCP73831T-3ACI/OT: Tape and Reel, 4.35V VREG, Options AC, 5LD SOT23 Pkg MCP73832-3ACI/MC: 4.35V VREG, Options AC, 8LD DFN Package MCP73832T-3ACI/MC: Tape and Reel, 4.35V VREG, Options AC, 8LD DFN Package MCP73831-4ADI/OT: 4.40V VREG, Options AD, 5LD SOT23 Pkg MCP73831T-4ADI/OT: Tape and Reel, 4.40V VREG, Options AD, 5LD SOT23 Pkg MCP73832-4ADI/MC: 4.40V VREG, Options AD, 8LD DFN Package MCP73832T-4ADI/MC: Tape and Reel, 4.40V VREG, Options AD, 8LD DFN Package MCP73831-5ACI/OT: 4.50V VREG, Options AC, 5LD SOT23 Pkg MCP73831T-5ACI/OT: Tape and Reel, 4.50V VREG, Options AC, 5LD SOT23 Pkg MCP73832-5ACI/MC: 4.50V VREG, Options AC, 8LD DFN Package MCP73832T-5ACI/MC: Tape and Reel, 4.50V VREG, Options AC, 8LD DFN Package
Options Temperature Package Range
Single-Cell Charge Controller Single-Cell Charge Controller (Tape and Reel) Single-Cell Charge Controller Single-Cell Charge Controller (Tape and Reel)
b) c)
Device:
MCP73831: MCP73831T: MCP73832 MCP73832T:
d) a) b) c) d) a) b)
Regulation Voltage:
Code 2 3 4 5 = = = =
VREG 4.20V 4.35V 4.40V 4.50V
Options: *
Code AC AD AT DC
IPREG/IREG 10 10 10 100
VPTH/VREG 66.5 66.5 71.5 x
ITERM/IREG 7.5 7.5 20 7.5
VRTH/VREG 96.5 94 94 96.5
c) d) a) b)
* Consult Factory for Alternative Device Options Temperature Range: I = -40C to +85C (Industrial)
c) MC OT = Dual-Flat, No-Lead (2x3 mm body), 8-Lead = Small Outline Transistor (SOT23), 5-Lead d) a) b) c) d) a) b) c) d)
Package:
* Consult Factory for Alternate Device Options
(c) 2006 Microchip Technology Inc.
DS21984B-page 21
MCP73831/2
NOTES:
DS21984B-page 22
(c) 2006 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."
*
* *
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and Zena are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2006, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company's quality system processes and procedures are for its PICmicro(R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
(c) 2006 Microchip Technology Inc.
DS21984B-page 23
WORLDWIDE SALES AND SERVICE
AMERICAS
Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Atlanta Alpharetta, GA Tel: 770-640-0034 Fax: 770-640-0307 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 San Jose Mountain View, CA Tel: 650-215-1444 Fax: 650-961-0286 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509
ASIA/PACIFIC
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ASIA/PACIFIC
India - Bangalore Tel: 91-80-4182-8400 Fax: 91-80-4182-8422 India - New Delhi Tel: 91-11-5160-8631 Fax: 91-11-5160-8632 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea - Gumi Tel: 82-54-473-4301 Fax: 82-54-473-4302 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Malaysia - Penang Tel: 60-4-646-8870 Fax: 60-4-646-5086 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-572-9526 Fax: 886-3-572-6459 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350
EUROPE
Austria - Wels Tel: 43-7242-2244-399 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820
02/16/06
DS21984B-page 24
(c) 2006 Microchip Technology Inc.

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